Integrated Circuit Packaging, Assembly and Interconnections
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.

Year:2010

Publisher:Springer

Language:English

Pages:312

ISBN 10:1441939237

ISBN 13:9781441939234

File:PDF, 37.71 MB

IPFS:CID , CID Blake2b