Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech­ nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo­ dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation­ ships between these characteristics are clearly explained and pre­ sented. In this excellent presentation, Dr. Hwang highlights three important areas of solder paste technology.
Contents
PART I-OVERVIEW 1
Chapter 1 Introduction 3
Chapter 2 Interdisciplinary Approach 23
PART II-BASIC TECHNOLOGIES 31
Chapter 3 Chemical and Physical Characteristics 33
Chapter 4 Metallurgical Aspects 71
Chapter 5 Rheology of Solder Pastes 123
PART III-METHODOLOGIES AND APPLICATIONS 151
Chapter 6 Application Techniques 153
Chapter 7 Soldering Methodologies 183
Chapter 8
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Year:1992

Edition:1

Publisher:Springer US

Language:English

Pages:461

ISBN 10:146153528X

ISBN 13:9781461535287

File:PDF, 16.68 MB

IPFS:CID , CID Blake2b